Multilayer PCB

Multilayer PCB Manufacturing

SprintPCB provides high-reliability Multilayer PCB fabrication for advanced electronic applications.

With years of experience in multilayer printed circuit board production, we support complex stack-ups from 4-layer PCB,6-layer PCB to 60-layer PCB, ensuring signal integrity, controlled impedance, and excellent reliability for high-density designs.

High-Quality Multilayer PCB Stack-Up & Engineering Support

Our engineering team optimizes Multilayer Printed Circuit Board stack-ups to achieve balanced construction, low warpage, and stable electrical performance. We offer FR4, high-Tg materials, hybrid laminates, and advanced prepregs for demanding environments.

Applications

Industrial control
Telecom & networking devices
Automotive electronics
AI Computing & High-Performance Servers
Such as Multilayer PCB and High Speed PCB for server motherboards; Impedance Control PCB and Mixed Laminate PCB for high-frequency signal integrity.

Multilayer PCB Capabilities

Technology Type	Capability
Number of manufacturing layers	4–60 layers
Special process	Blind/buried vias
Material	High-Tg, Halogen-free, Rogers hybrid options
Drilling type	Laser drilling & precise registration
Copper thickness	up to 6 oz
Other	Controlled impedance

PCB Roadmap

Feature	Prototype production	Mass production	R&D
Layers count	1-40	1-20	60
Minimum board thickness (with solder mask)	0.3mm	0.6mm	0.20mm
Maximum board thickness	6mm	4mm	10mm
Maximum board size	546mm x 622mm	457mm x 610mm	1250mm x 570mm
Minimum line/space innerlayer (depends on copper weight)	2.5mil/2.5mil	3mil/3mil	2mil/2mil
Surface finish types	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG
Mechanical hole size (Finish hole size)	0.15 mm	0.2 mm	0.1 mm
Maximum aspect ratio PTH	20:01	12:01	20
Finished tolerance PTH	+/-0.075 mm	+/-0.05 mm	+/-0.025 mm
Finished tolerance NPTH	+/-0.05 mm	+/-0.025 mm	+/-0.015 mm
Epoxy filled through holes (Y/N)	Y	Y	Y
Capped via (Heat dissipation) (Y/N)	Y	Y	Y

PCB Delivery Time

PCB Quantity (㎡)	2-10 Layer PCB Delivery Time	12-20 Layer PCB Delivery Time
＜1㎡	1 – 8 days	4 – 13 days
1 ㎡ – 5 ㎡	2 – 10 days	5 – 15 days
6 ㎡ – 20 ㎡	4 – 15 days	7 – 19 days
≥20㎡	7 – 18 days	10 – 23 days

Other PCB products

Providing you with one-stop PCB manufacturing and PCB assembly services

Reliable and stable products

Professional engineering support

Fast and on-time delivery

Full-process customer service

Our PCB manufacturing equipment

SprintPCB Group possesses the industry’s most advanced PCB manufacturing equipment, ensuring your PCB products are delivered to you with the highest quality on time and within the agreed delivery period.