{"version":"1.0","provider_name":"SprintpcbGroup","provider_url":"https:\/\/www.sprintpcbgroup.com\/sv","author_name":"sprintpcbgroup","author_url":"https:\/\/www.sprintpcbgroup.com\/sv\/author\/sprintpcbgroup\/","title":"Microvia PCB Quality Control: How Plating Parameters Affect Via Filling Results","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"8496w93bGH\"><a href=\"https:\/\/www.sprintpcbgroup.com\/sv\/blogs\/microvia-pcb-quality-control-via-filling\/\">Microvia PCB Quality Control: How Plating Parameters Affect Via Filling Results<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.sprintpcbgroup.com\/sv\/blogs\/microvia-pcb-quality-control-via-filling\/embed\/#?secret=8496w93bGH\" width=\"600\" height=\"338\" title=\"\u201dMicrovia PCB Quality Control: How Plating Parameters Affect Via Filling Results\u201d &ndash; SprintpcbGroup\" data-secret=\"8496w93bGH\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.sprintpcbgroup.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>","thumbnail_url":"https:\/\/www.sprintpcbgroup.com\/wp-content\/uploads\/2026\/04\/microvia-pcb-manufacturing-equipment-1.webp","thumbnail_width":600,"thumbnail_height":400,"description":"As a PCB engineer with years of industry experience, I share a real-life account regarding microvia PCB production. An incident where a lapse in plating parameters led to voids forming in micro-blind vias taught me a profound lesson about the critical importance of process details. No matter how advanced the equipment, it cannot compensate for human error. Sometimes, traditional processes prove to be more reliable\u2014for instance, combining secondary electroless copper deposition with pulse plating; although time-consuming, this method guarantees a yield rate exceeding 98%. In today's pursuit of \"Any-Layer Interconnect\" technology, a solid foundation in process engineering is the true key to mic..."}