1.0SprintpcbGrouphttps://www.sprintpcbgroup.com/svsprintpcbgrouphttps://www.sprintpcbgroup.com/sv/author/sprintpcbgroup/From Dense to Reliable: Overlooked Practical Issues in BGA PCB Designrich600338<blockquote class="wp-embedded-content" data-secret="6klUUrJDvg"><a href="https://www.sprintpcbgroup.com/sv/blogs/bga-pcb-design-overlooked-practical-issues/">From Dense to Reliable: Overlooked Practical Issues in BGA PCB Design</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.sprintpcbgroup.com/sv/blogs/bga-pcb-design-overlooked-practical-issues/embed/#?secret=6klUUrJDvg" width="600" height="338" title="”From Dense to Reliable: Overlooked Practical Issues in BGA PCB Design” – SprintpcbGroup" data-secret="6klUUrJDvg" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script>
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</script>https://www.sprintpcbgroup.com/wp-content/uploads/2026/03/bga-pcb-manufacturing-equipment-1.webp600400BGA packaged PCB design may seem high-end, but it hides many practical problems. Overly pursuing high routing density often leaves no place for test points, making even basic circuit testing difficult. Even more troublesome are the solder joint issues hidden beneath the chips; sometimes even X-ray machines cannot detect micro-cracks caused by PCB lamination stress. Many designs use miniature laser vias for test points to save space, but this creates significant difficulties for subsequent repairs. Instead of relying on complex testing methods, it's better to reserve space during layout...