{"version":"1.0","provider_name":"SprintpcbGroup","provider_url":"https:\/\/www.sprintpcbgroup.com\/ko","author_name":"sprintpcbgroup","author_url":"https:\/\/www.sprintpcbgroup.com\/ko\/author\/sprintpcbgroup\/","title":"From Industrial Control to RF: My Practical Experience and Reflections on 4-Layer PCB Stack-Up","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"GlVXpVPN56\"><a href=\"https:\/\/www.sprintpcbgroup.com\/ko\/blogs\/4-layer-pcb-stackup-industrial-control-to-rf\/\">From Industrial Control to RF: My Practical Experience and Reflections on 4-Layer PCB Stack-Up<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.sprintpcbgroup.com\/ko\/blogs\/4-layer-pcb-stackup-industrial-control-to-rf\/embed\/#?secret=GlVXpVPN56\" width=\"600\" height=\"338\" title=\"&#8220;From Industrial Control to RF: My Practical Experience and Reflections on 4-Layer PCB Stack-Up&#8221; &#8212; SprintpcbGroup\" data-secret=\"GlVXpVPN56\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.sprintpcbgroup.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>","thumbnail_url":"https:\/\/www.sprintpcbgroup.com\/wp-content\/uploads\/2026\/01\/4-layer-pcb-stackup-manufacturing-equipment-1.webp","thumbnail_width":600,"thumbnail_height":400,"description":"In a 4-layer PCB design, is placing the ground plane on the second layer truly the only option? This article explores the possibility of placing the power plane on L2 based on practical project experience, and how to flexibly adjust the stack-up structure according to circuit requirements. Whether it's an industrial control motherboard or an RF module, a reasonable stack-up design can effectively shorten power paths, optimize signal references, and even improve antenna performance. Breaking with conventional thinking, a 4-layer PCB stack-up design is more like an art of balance, requiring consideration of specific application scenarios..."}