PCBA Capability

Advanced PCB Assembly for Fine-Pitch & Complex Designs

SprintPCB delivers complete SMT and THT assembly solutions for high-density, fine-pitch, and mixed-technology PCBs.
With IC programming and automated inspection integrated into our lines, we provide stable, high-reliability PCBA for demanding applications.

0201, 0402, BGA, QFN, LGA, connectors, and functional modules.

Component placement accuracy up to ±25μm for fine-pitch and high-density layouts.

In-circuit or off-board programming before or after PCB assemblyPCB

AOI, X-ray inspection for BGA, ICT, and functional testing per specifications.

AOI, X-ray inspection for BGA, ICT, and functional testing per specifications.

Fully compliant with RoHS standards and lead-free soldering processes.

Item	Category		Standard Process	Advanced / Non-Standard Process
PCB Requirements for SMT	Board Size (L × W)	Maximum	L ≤ 460 mm	L > 460 mm
		Maximum	W ≤ 400 mm	W > 400 mm
		Minimum	L ≥ 50 mm	L < 50 mm
		Minimum	W ≥ 30 mm	W < 30 mm
	PCB Thickness	Maximum	4.5 mm	> 4.5 mm
	PCB Thickness	Minimum	0.5 mm	< 0.5 mm
SMT Component Capability	Specification	Component Height	≤ 6.5 mm	6.5 mm < H ≤ 15 mm
		Maximum Component Size	200 × 125 mm	> 200 × 125 mm
		Minimum Component Dimensions	201	1005
		Minimum Component Dimensions	0.6 × 0.3 mm	0.3 × 0.2 mm
	Fine-Pitch ICs (QFP, SOP, SOJ, etc.)	Minimum Lead Pitch	0.4 mm	0.3 mm < Pitch < 0.4 mm
	CSP / BGA Packages	Minimum Ball Pitch	0.5 mm	0.3 mm < Pitch < 0.5 mm
Inspection & Testing	Visual Inspection, In-Circuit Test (ICT), Flying Probe Test (FPT), Automated Optical Inspection (AOI), Automated X-Ray Inspection (AXI), Burn-In Testing

- 중소규모 배치 생산 전문가
- 고정밀 PCB 제작 및 자동화된 조립
- OEM/ODM 전자 프로젝트를 위한 신뢰할 수 있는 파트너

영업 시간: (월~토) 9:00~18:30