{"version":"1.0","provider_name":"SprintpcbGroup","provider_url":"https:\/\/www.sprintpcbgroup.com\/ja","author_name":"sprintpcbgroup","author_url":"https:\/\/www.sprintpcbgroup.com\/ja\/author\/sprintpcbgroup\/","title":"How This PCB Layer Stackup Design Ended Up Bending the Board into a Banana","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"p35vIfRlg8\"><a href=\"https:\/\/www.sprintpcbgroup.com\/ja\/blogs\/pcb-layer-stackup-design-board-warping-issue\/\">How This PCB Layer Stackup Design Ended Up Bending the Board into a Banana<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.sprintpcbgroup.com\/ja\/blogs\/pcb-layer-stackup-design-board-warping-issue\/embed\/#?secret=p35vIfRlg8\" width=\"600\" height=\"338\" title=\"&#8220;How This PCB Layer Stackup Design Ended Up Bending the Board into a Banana&#8221; &#8212; SprintpcbGroup\" data-secret=\"p35vIfRlg8\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.sprintpcbgroup.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>","thumbnail_url":"https:\/\/www.sprintpcbgroup.com\/wp-content\/uploads\/2026\/03\/pcb-layer-stackup-manufacturing-equipment-1.webp","thumbnail_width":600,"thumbnail_height":400,"description":"Over my years in hardware design, I\u2019ve witnessed far too many painful lessons caused by PCB warping. A board bending after high-temperature soldering might seem like a minor issue, but it can potentially render the entire circuit board\u2014and all its components\u2014completely useless. The root cause often lies in an asymmetrical PCB layer stackup design\u2014specifically, stacking all the power planes on one side while leaving the other side entirely filled with signal traces. This creates an imbalance in the coefficients of thermal expansion. Even more insidious is the role of prepreg flow during the lamination process; this can create uneven internal stresses within the board, meaning that even if the board appears perfectly flat right out of the factory..."}