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When Design and Manufacturing Are Disconnected: Common Causes of Failure in PCB HDI Projects
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I have seen far too many teams oversimplify the complexities of HDI projects. They often operate under the assumption that simply finding a supplier capable of manufacturing “any-layer” HDI boards is enough to ensure success. In reality, the true challenges—and the seeds of potential failure—are often planted during the design phase itself.
I recall a client in the medical device sector who came to me with a complex 8-layer board design, seeking help with a persistent issue. While their previous supplier was indeed capable of handling the high-density interconnect processes, the client’s design team had completely failed to account for thermal dissipation paths. Consequently, the product’s performance fluctuated wildly during high-temperature testing. We subsequently redesigned the micro-via layout, creating distinct zones for thermal vias and signal vias; this strategic partitioning finally resolved the underlying thermal issue.
Many engineers today fall into a common trap: an excessive pursuit of the absolute limits of technical parameters. For instance, they might insist on utilizing the minimum possible trace width while overlooking the inherent tolerance fluctuations that occur during actual mass production. I once reviewed a design where the solder mask bridge width had been pushed right to the very edge of the manufacturing process limits; although the design looked flawless on paper, the production yield plummeted by 20% once mass manufacturing began.
When selecting a supplier, I place a premium on the speed and quality of their engineering feedback. A truly effective partner will provide specific, actionable improvement suggestions within 24 hours of receiving the design files—rather than offering a generic “yes, we can build this” or “no, we can’t.” On one occasion, a manufacturer we were collaborating with in Shenzhen went so far as to use simulation software during a video conference to demonstrate potential impedance mismatch risks in real-time. That kind of interactive, real-time engagement is far more convincing than any stack of qualification certificates.
The level of cooperation during the testing phase is, likewise, absolutely critical. Some manufacturers consider their job done the moment they ship out samples; truly professional teams, however, proactively provide cross-section reports and thermal analysis data. The most reliable collaboration I’ve ever experienced involved a supplier bringing their testing equipment directly to our lab to conduct on-site signal integrity tests, with engineers from both sides working together to fine-tune parameters until the waveforms stabilized.
In reality, the success or failure of a PCB HDI project often hinges on the ability to handle minute details. For instance, we once discovered that the pad diameter in a specific BGA area was 0.05 millimeters smaller than the standard. Although the discrepancy appeared negligible on paper, this slight deviation caused excessive voids to form during the soldering process. The supplier subsequently suggested expanding the solder mask opening by 5%, and the problem was instantly resolved.
The collaborative model I appreciate most is one where the design and manufacturing teams share simulation data. Some suppliers proactively provide access to their process parameter libraries, allowing us to directly import and apply these validated rules within our design software. This level of deep collaboration is far more efficient than engaging in repetitive revisions later in the process.
Ultimately, as HDI technology has matured, the hardware gap between manufacturers has narrowed significantly; the true differentiator now lies in the depth of collaboration between engineering teams. The partners who are willing to pull all-nighters with you to debug impedance issues—who can analyze cross-sections under a microscope and quickly propose alternative solutions—are the ones who truly guarantee a project’s success.
I’ve seen far too many teams blindly chasing high-density interconnect technology. Whenever I see someone treat HDI as a panacea, I can’t help but find it amusing. While it’s true that HDI can make circuit boards smaller and thinner, do you really need to make your mobile phone as thin as a sheet of paper? Sometimes, I feel as though the industry has gotten caught up in a strange, pointless race.
I recall a rugged outdoor device we developed last year. The original plan called for an eight-layer “any-layer” HDI stackup; however, our engineers discovered that by switching to a standard four-layer board and optimizing the layout, we could fully meet all performance requirements. The cost savings allowed us to increase the battery capacity by 30%—a change that actually left our users even more satisfied. Not every product needs to chase the absolute limit of interconnect density; the key is finding the right balance.
Nowadays, the moment people mention PCB design, their minds immediately jump to stacked microvias. Yet, in certain scenarios, standard through-hole technology actually proves to be more reliable. I once managed an industrial controller project where the client insisted on using high-end HDI technology; unfortunately, due to inconsistencies in the supplier’s manufacturing process, the entire batch of products had to be reworked. Sometimes, the simplest solution turns out to be the smartest choice.
Take a good look at the project currently on your desk: just how high a level of integration does it truly require? If you’re merely cramming in a bunch of unnecessary features—simply to make the product look high-tech or premium—you’d be far better off investing that money into enhancing the actual user experience instead. Good design should be like choosing an outfit: a proper fit is paramount—far more important than blindly chasing the latest trends.
I have always maintained that technology exists to serve specific needs. When considering whether to adopt High-Density Interconnect (HDI) technology, ask yourself this first: Does the user really care about a difference of a few millimeters in thickness? Does the added cost translate into commensurate value? Sometimes, taking a step back to view the problem from a broader perspective actually leads to a more elegant solution.
I can’t help but chuckle whenever I see someone blindly chasing after HDI technology. Last year, when our team took over a wearable tech project, we nearly stumbled over this very issue—the client insisted on using a 4-layer HDI board, believing it would project a “premium” image, but reality soon taught them a harsh lesson.
Do you really think those dense arrays of micro-vias will deliver a quantum leap in performance? In reality, the vast majority of consumer electronics products simply do not require that level of precision. I’ve seen far too many engineers treat PCB HDI complexity as a badge of honor, while completely overlooking the fundamental question: Are users truly willing to pay a premium for these invisible technical features?
I recall a team working on a medical monitoring wristband that stubbornly insisted on using an 8-layer “any-layer interconnect” design. Consequently, they spent two months just waiting for the specialized materials to arrive; by the time the prototypes were finally ready, the market had already been completely captured by their competitors. Such miscalculations regarding lead times are often far more fatal than any technical flaw.
Nowadays, whenever a client requests HDI, my immediate reaction is to ask about their projected mass production volume. Attempting to implement high-end interconnects for small-batch production is essentially throwing money into a bonfire. Setting aside the prototyping fees—which can easily run into the hundreds of thousands—the sheer time cost incurred by suppliers repeatedly revising engineering data alone can completely derail an entire project timeline.
The truly intelligent approach is to learn the art of subtraction. On a recent drone project, the initial design called for extensive use of blind and buried vias. However, we later discovered that by simply tweaking the component layout, we could achieve identical performance using a standard 1-layer HDI board. This move directly saved the client 30% on board manufacturing costs and shaved three weeks off the R&D schedule.
Sometimes, choosing a technical path is just like picking out clothes: a proper fit is far more important than mere flashiness. Don’t let yourself be swayed by flashy examples of technical showmanship; first, carefully calculate the hidden costs you’ll have to pay for that so-called “technical upgrade.”
When designing circuit boards, one frequently encountered misconception is the belief that simply adopting HDI technology will automatically elevate a product to a “premium” tier. In reality, however, it all depends on the specific context. I’ve seen numerous engineers dive headfirst into pursuing the most advanced HDI designs right from the start—only to see costs spiral out of control, ultimately resulting in a product that simply fails to sell. Take, for instance, a smart home gateway we developed last year. Initially, some team members insisted on utilizing “any-layer interconnect” technology, arguing that it was the only way to demonstrate the product’s technical sophistication. However, upon a practical teardown analysis, we discovered that the pin pitch of the main chip was not nearly as dense as assumed; a standard micro-via and blind-via process would have been entirely sufficient. We subsequently switched to a second-order design; the resulting cost savings were directly reflected in the retail price, ultimately enhancing the product’s market competitiveness.
Occasionally, during design reviews, we observe that engineers hold misconceptions regarding the appropriate “order” (layer complexity) of the PCB design. Not every product requires—or benefits from—pursuing the highest-density interconnect solution available. For example, certain industrial control devices, despite their complex circuitry, do not impose stringent constraints on physical size; in such cases, adopting a lower-order HDI approach is actually the more rational choice. The critical factor is to base decisions on actual signal transmission requirements and spatial limitations. When evaluating signal integrity, for instance, one must analyze the rise times and transmission paths of critical signals; if standard through-holes can adequately meet the latency requirements, there is no need to blindly resort to more expensive laser-drilled blind vias. Furthermore, thermal management requirements must be taken into account, as high-density routing can sometimes interfere with thermal conduction paths.
I particularly admire a design philosophy that strikes an excellent balance between cost and performance. I once observed a mainboard for a medical device—designed by a peer company—in which they cleverly applied micro-via technology only in critical areas, while utilizing traditional manufacturing processes for the remainder of the board. This approach ensured the stability of core functionalities while effectively keeping overall production costs in check. Such a pragmatic attitude is truly worthy of emulation. By using simulation software to pre-assess the current-carrying requirements of different board regions, they reserved traditional through-holes for high-current zones—such as power supply modules—and applied HDI processes only in dense areas, such as beneath BGA packages. This hybrid design strategy successfully optimized the cost structure without compromising reliability.
Nowadays, many startup teams tend to fall into the trap of “technological fetishism”—blindly chasing after impressive technical specifications for their own sake. In reality, a truly exceptional designer should operate much like a traditional Chinese medicine practitioner taking a patient’s pulse: first, accurately diagnosing the product’s genuine needs, and only then prescribing the appropriate remedy. After all, the ultimate purpose of PCB design is to serve the product, not merely to serve as a vehicle for technical showmanship. For instance, wearable devices demand an extremely compact layout, making high-order HDI an absolute necessity; conversely, control boards for home appliances often require nothing more than a solution to meet basic interconnection needs.
Speaking of the application of micro-via technology, I believe the most critical aspect is to fully comprehend how different manufacturing processes impact overall product reliability. Some designs, in their pursuit of extreme density, adopt overly aggressive stacking schemes—only to encounter frequent failures during thermal cycling tests. This serves as a reminder that, when selecting an HDI solution, long-term reliability must always be the top priority. This is especially critical for automotive electronics, which are subject to mechanical vibration; here, one must carefully evaluate the compatibility between the copper thickness of the via walls and the Coefficient of Thermal Expansion (CTE) of the substrate to prevent connection failures caused by thermal expansion mismatches.
I recently reviewed a drone flight control board design for a friend, and the case was quite interesting. They initially intended to use a 4th-order HDI process; however, they later discovered that by optimizing the layout, a 2nd-order design—combined with a sensible buried-via strategy—was sufficient to meet all requirements. This adjustment immediately slashed the board’s manufacturing cost by 40% while significantly boosting the production yield. By rerouting certain traces at 45-degree angles and utilizing “postage stamp” edge connections, they managed to reduce the number of blind vias while simultaneously preserving signal integrity—an optimization that perfectly exemplifies the flexibility inherent in sound engineering thinking.
In reality, the greatest pitfall in hardware design is becoming detached from market realities and engaging in purely academic technical exercises. Whenever I see products that pile on the latest cutting-edge technologies yet fail to gain market traction, I am reminded of something an experienced veteran engineer once told me:
“It always strikes me as a pity when people oversimplify High-Density Interconnect (HDI) technology, viewing it merely as a tool for shrinking circuit board dimensions. Such a perspective overlooks the truly fascinating aspect of this technology: it fundamentally alters the way we approach the design of electronic products.”
I, too, made this very mistake when I first began working with HDI technology. Back then, I believed that simply arranging components more compactly was sufficient. It wasn’t until I hit a design bottleneck that I realized the true nature of the problem: our team had become so fixated on cramming more components into a limited space that we completely neglected the quality of signal transmission. The interference generated between those densely packed traces nearly derailed the entire project.
This experience compelled me to consider another dimension of HDI technology: it effectively redefines the boundaries of what is possible in electronic product design. When you are no longer constrained by traditional through-hole design methodologies, you can create product form factors that were previously unimaginable. For instance, the fact that many modern medical devices can be made so compact and sophisticated is a direct result of this shift in design philosophy.
A project I recently participated in gave me an even deeper appreciation for this concept. We were tasked with implementing complex functionality on an extremely small circuit board—a challenge that traditional through-hole design methods simply could not accommodate. Shifting to High-Density Interconnect (HDI) design not only resolved space constraints but also—quite unexpectedly—enhanced product reliability, as the finer routing reduced unnecessary signal attenuation.
Sometimes I find myself wondering: had we recognized the full potential of HDI technology a few years sooner, the evolutionary paths of many products might have unfolded in a completely different manner. It is not merely about shrinking circuit boards; it represents a pivotal step toward making electronic products smarter and more efficient.
It is truly gratifying to see an increasing number of industries now recognizing the comprehensive value of this technology. After all, the future of electronics depends less on raw processor speed or storage capacity, and more on these seemingly fundamental—yet critically important—design choices.
I have encountered quite a few engineers who blindly pursue HDI technology right from the initial design phase. In reality, a traditional multilayer board—combined with a sensible layout—is often sufficient to solve the problem at hand. I recall a friend working in the smart home sector who once spent a fortune implementing an 8-layer “any-layer” HDI board for a gateway device. The ironic result? The device’s overall housing ended up being significantly larger than that of the previous generation. Such an approach—pursuing technology for technology’s sake—is truly open to debate.
Nowadays, many manufacturers treat HDI as a universal panacea. In practice, however, the primary consideration should be the product’s ultimate operating environment. If, for instance, the device is an industrial controller destined for a factory floor, there is absolutely no need to shrink the circuit board down to the size of a postage stamp. Instead, priority should be given to allocating ample space for heat dissipation and maintenance accessibility. In such scenarios, blindly chasing high micro-via density can actually introduce reliability issues.
A project I managed some time ago serves as a perfect illustration of this point. The client was adamant about utilizing the most advanced buried-via technology for an outdoor surveillance device. Consequently, the device suffered connection failures when subjected to environments with significant temperature fluctuations. We subsequently reverted to a conventional through-hole design, coupled with an appropriate potting process; surprisingly, the failure rate plummeted to below 0.3%.
Situations that genuinely warrant the use of high-density technology typically possess distinct characteristics—for instance, the need to squeeze a millimeter-wave radar module into a wearable device, or to integrate a high-definition image sensor into the tip of a medical endoscope. These represent scenarios where the need for such technology is truly indispensable.
Occasionally, opting for a more conservative design strategy can actually yield greater market success. The controller we developed for a power tool manufacturer last year serves as a prime example. By adhering to a mature, double-sided through-hole process—supplemented by a manual soldering repair protocol—we not only maintained a consistent yield rate exceeding 98%, but also reduced after-sales service costs by nearly 40% compared to our competitors.
There is a simple litmus test for determining whether or not to adopt a new technology: ask yourself if the end user can directly perceive—and benefit from—the resulting improvement in value. If an innovation amounts to nothing more than an engineer’s self-indulgent exercise—innovating merely for the sake of it—then the budget would be better spent on improving other aspects of the user experience.
Several automotive electronics projects I’ve encountered recently serve as interesting examples. Despite there being ample space in the trunk, the team insisted on shrinking the circuit board down to the size of a credit card. This decision made the thermal management design—specifically, heat dissipation—unnecessarily complex. Such a case of misplaced priorities is, unfortunately, not uncommon in this industry.
Ultimately, technological choices should serve the fundamental essence of the product. Much like cooking requires finding the perfect balance of heat and timing, circuit board design demands finding that sweet spot. One must neither cling to outdated methods and miss out on the benefits of technological advancements, nor engage in technological showboating that incurs unnecessary costs and risks.
Every project should be guided by its own specific logic for technology selection. This logic must be grounded in the actual operating environment, projected production volume, and ongoing maintenance requirements—rather than being driven by blind trend-following or a mere obsession with achieving impressive technical specifications.
Sometimes, the most suitable solutions are the simplest ones.
I’ve long felt that many people harbor a misconception regarding High-Density Interconnect (HDI) technology. They seem to believe that simply incorporating this technology automatically elevates the product to a superior tier. In reality, it’s not quite that simple.
I recall a similar dilemma our team faced last year while designing a portable device. At the time, some members proposed adopting a high-end, advanced solution in pursuit of absolute peak performance. However, after conducting a practical teardown analysis, we realized that for the vast majority of consumer electronics products, such an aggressive approach is simply unnecessary.
I have witnessed far too many instances where teams blindly chased technical metrics only to end up derailing their entire project. This is particularly true when dealing with multi-layer stacking structures, where the manufacturing complexity tends to increase exponentially. Sometimes, a seemingly ordinary through-hole design can actually resolve most issues—and do so with greater reliability.
Cost control remains an unavoidable topic of discussion. Some clients invariably expect to achieve top-tier specifications on a shoestring budget—an expectation that is inherently unrealistic. I typically advise them to first clearly define their product’s market positioning before deciding how much financial and technical resources to allocate to this specific area.
On one occasion, we took over a project that had stalled midway because the previous team’s excessive design had caused the budget to spiral out of control. After a re-evaluation, we switched to a more pragmatic approach—a move that not only saved 30% on expenses but also allowed us to deliver the project two weeks ahead of schedule.
The true test of an engineer’s skill lies in achieving the optimal balance within limited constraints. After all, good design isn’t about simply piling on the most advanced technologies; it’s about ensuring that every component fits its purpose perfectly.
Currently, some manufacturers in the market like to use technical specifications as marketing gimmicks, which can be quite misleading. In reality, users don’t care how complex the manufacturing processes you employed were; they only care whether the product is easy to use and durable.
I believe that instead of agonizing over whether to adopt the latest technologies, it is better to first build a solid foundation. Many seemingly ordinary designs, once optimized, can deliver excellent performance—and often offer superior stability as well.
A project I’ve been working on recently offers a great example: the client initially insisted on an eight-layer “any-layer interconnect” structure. However, after we demonstrated a six-layer hybrid design solution, they changed their mind on the spot.
Ultimately, technology is merely a tool; what matters is how effectively you wield it. Sometimes, the simplest solution is the one that truly demonstrates the greatest mastery.
I’ve been spending a lot of time lately delving into the specifics of HDI (High-Density Interconnect) technology. To be honest, many people assume that simply making the circuit traces thinner is all that’s required—but that couldn’t be further from the truth. I recall a project last year where we utilized an eight-layer “any-layer” HDI stack-up; we subsequently discovered issues during the via-filling stage, which severely compromised signal integrity.
That experience made me realize that the choice of substrate material is far more critical than we had previously imagined. Sometimes, you might spend a fortune perfecting a micro-blind via design, only to be tripped up by the most fundamental element: the dielectric layer. This is especially true when a product requires high-frequency, high-speed operation; traditional FR4 materials simply aren’t up to the task.
I’ve seen far too many teams pour all their energy into maximizing circuit density while completely neglecting the fundamental issue of thermal management. During a teardown analysis of a competitor’s product, we discovered that they had embedded copper blocks within their PCB HDI stack-up—a technique that instantly elevated their thermal dissipation performance to a whole new level. This approach is well worth emulating: high-density interconnects should never come at the expense of reliability.
There is a common misconception within the industry right now that newer technology is inherently better. However, in practical application, you often find that many “fancy” HDI processes are simply unsuitable for mass production. For instance, certain specialized via-filling techniques might theoretically boost performance by 10%, but they can simultaneously drive the manufacturing yield rate down to an unacceptably low level.
Lately, I’ve been experimenting with a hybrid approach: applying high-order HDI technology to critical areas of the board, while maintaining a conventional design for the less critical sections. This approach allows us to keep costs in check while simultaneously ensuring core performance. After all, product development isn’t academic research; ultimately, its success depends on market acceptance.
There is a fascinating phenomenon I’ve observed: whenever people mention HDI, they tend to think exclusively of smartphones. In reality, however, the demand for high-density interconnects is often far more urgent within the industrial equipment sector. Take medical devices, for instance: their control boards must pack a vast array of functions into a severely limited space—a requirement that actually places even higher demands on the stability of the substrate.
I’ve come to feel increasingly that working in this field requires a certain wisdom of balance. Not every project needs to chase the most extreme technical parameters; sometimes, a design that is “just right” can actually yield superior overall benefits. After all, an engineer’s true value lies not in how many flashy, high-tech tricks they employ, but in their ability to genuinely solve real-world problems.
I often feel that many people today harbor a sort of blind reverence for HDI—as if simply adopting high-density interconnect technology will automatically elevate a product to a higher tier. In fact, our team learned this lesson the hard way just last year: in a misguided pursuit of “ultra-thin and lightweight” design, we insisted on implementing a six-layer HDI structure. The result? Not only did our costs skyrocket—effectively doubling—but our entire supply chain became completely gridlocked, held hostage by a single Taiwanese manufacturer.
That experience taught me a valuable lesson: while HDI can indeed boost circuit board routing density, not every product actually requires such extreme density. It’s akin to insisting on installing a racing engine in a car when all you really need is a basic commuter vehicle. Nowadays, whenever we evaluate a new product concept, we start by asking a very fundamental question: Can we achieve 80% of the required functionality using a standard PCB? If the answer is yes, then we hold off on rushing into HDI.
I’ve recently been reviewing controller projects for new energy vehicles, and the experience has been particularly illuminating. Some manufacturers, in a bid to save a mere few millimeters of space, stubbornly insist on using HDI processes—only to see their procurement lead times balloon to four months. Conversely, those who opt for conventional PCBs combined with optimized layouts manage to both keep costs under control and ensure stability during mass production. Ultimately, supply chain resilience is far more critical than being at the bleeding edge of technology—especially given the current global climate of frequent material price and availability fluctuations.
The smartest approach I’ve witnessed involves a layered design strategy: using HDI for the critical core components while sticking to traditional processes for the remaining areas. This allows you to reap the benefits of high-density interconnects without betting your entire supply chain on a handful of high-end manufacturers. After all, the number of factories capable of reliably producing HDI boards with eight or more layers is so small you could count them on two hands; if a snag develops at any single stage of that process, the entire project grinds to a halt.
Sometimes, I feel that our industry should spend less time obsessing over technical specifications and more time discussing how to ensure technology truly serves the fundamental essence and purpose of the product itself. Good design isn’t about blindly piling on the most cutting-edge technologies; rather, it’s about striking the most sensible balance within limited resources.
Whenever I see people talk about HDI technology as if it were some kind of magic, I can’t help but chuckle. To be honest, it’s just a tool—used in the right context, it can be the icing on the cake; used incorrectly, it becomes a drag. I’ve seen far too many teams chase after a perceived sense of “high-end” status by forcing an “Any-Layer HDI” approach, only to find themselves bogged down in a quagmire of spiraling costs.
If you’re asking whether you should upgrade your PCB to an HDI process, I think we need to clarify one thing first: does your product actually require that level of integration density? For instance, smartwatches certainly need to cram a multitude of functions into a tiny footprint; however, many standard consumer electronics simply don’t require such dense routing. Sometimes, simply optimizing the layout on a traditional multi-layer board yields a far more practical and effective result.
Speaking of mass production, there’s an interesting anecdote I’d like to share. Last year, we worked on a medical device project where the client initially insisted on using Any-Layer HDI—their goal was to create the thinnest implantable sensor in the industry. We reached out to three different suppliers; two claimed they could handle the job, but during the actual prototyping phase, they couldn’t even maintain stable impedance control. We eventually switched to a manufacturer specializing in 2-layer HDI. Although the resulting board ended up being 0.2mm thicker, the production yield skyrocketed from 60% to 95%, and we managed to cut costs by a third.
There’s a peculiar phenomenon in the industry right now: it seems as though failing to use HDI is perceived as a sign of technological backwardness. However, those who truly understand the trade know that the density gains offered by higher-order HDI designs are subject to diminishing returns. With every additional layer, the costs, risks, and lead times increase exponentially, while the actual space savings might be less significant than simply switching a specific chip to a different package type.
I’d like to offer a specific word of caution to engineers just starting out in the field: don’t let yourself be swayed by supplier marketing hype. When manufacturers claim they can handle “the full spectrum of HDI designs,” you need to dig deeper and see what products they’ve actually mass-produced. Do they have long-term clients? Do they frequently manufacture boards with specifications similar to yours? Some manufacturers may possess impressive-looking equipment, but if their process stability is poor, you’re the one who will ultimately pay the price.
In reality, there’s a very simple method for deciding whether to adopt HDI: first, try designing a version using conventional processes. Only if you encounter a specific area where routing is absolutely impossible should you consider a localized upgrade. In most cases, 2-layer HDI is sufficient to resolve 90% of the issues you’ll face; there really is no need to tackle the manufacturing complexities of Any-Layer HDI solely for the sake of marginal, theoretical performance gains. Some of the foldable-screen projects I’ve encountered recently serve as prime examples. One team insisted on shrinking the motherboard down to the size of a fingernail—a decision that resulted in a drastic reduction in battery capacity. Another team, however, opted for a slightly larger board, thereby turning long battery life into a key selling point. Ultimately, the technical choices made reflect a team’s holistic grasp of the product as a whole—something that cannot be determined merely by looking at PCB specifications.
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