Yes. Hybrid PCBs use different materials to balance cost and performance—for example, combining standard FR4 with high-frequency cores in one stack-up.

It is hard to give a precise answer, but we have made tests with material with up to 22 reflows, four of these with a peak temperature of 270C°. The stress after 22 reflows is considerable, and the material can degrade, but all connections remained functional. Our recommendation is to choose a higher-grade material where there are more than 6 layers and thicker than 1.6 mm.

There is no “best surface”; all surfaces have their pros and cons. Which one you should choose depends on many factors. Please consult our technicians.

Before we begin manufacturing the PCBs, we require you to provide the necessary files, such as Gerber data files, aperture files, drill files, and circuit board specifications. We will then begin manufacturing the PCB circuit boards based on these specifications and files.

Our PCB manufacturing process: PPE(Pre Production Engineering) – Material issue – Inner layer – Inner layer etch – Lamination – Drilling – PTH(Plated Through Hole) – Panel plating – Outer layer image – Pattern plate – Outer layer etch – Outer layer AOI – Soldermask – Silkscreen – Surface finish – Profiling – ET(Electrical Test) – Final inspection – Packaging

Yes, we support custom PCB products, as well as custom packaging and labeling. We will first evaluate your requirements; please contact us to discuss your detailed product customization needs.