{"id":11740,"date":"2026-10-17T15:00:00","date_gmt":"2026-10-17T07:00:00","guid":{"rendered":"https:\/\/www.sprintpcbgroup.com\/?p=11740"},"modified":"2026-10-17T10:42:00","modified_gmt":"2026-10-17T02:42:00","slug":"kvm-switch-pcb-signal-integrity-design","status":"publish","type":"post","link":"https:\/\/www.sprintpcbgroup.com\/es\/blogs\/kvm-switch-pcb-signal-integrity-design\/","title":{"rendered":"KVM Switch PCB Design: Signal Integrity, EDID and USB Emulation Tips for Glitch-Free 4K Switching"},"content":{"rendered":"
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The Board Is the Most Overlooked Part of a KVM Switch<\/h2>

When building a KVM switch, the part most easily overlooked but most critical is actually the circuit board itself. Many people start by pondering which vendor’s switching chip, signal repeater or USB hub controller to use, and when the board comes back and is tested, the high-speed signal collapses right after switching. Two years ago, when I made a rack KVM for a broadcast-grade control room, I flipped over exactly this way.<\/p>

I thought simply at the time: find an ordinary multilayer pcb manufacturer to make a 12-layer board, send the parameters, with the impedance requirement marked. When the physical board arrived and went onto the VNA, the differential impedance floated all over the place. Tracing it back, the factory’s lamination process was unstable, dielectric thickness tolerance was too large, and line width compensation was also a mess. This taught me a principle: if you are making a KVM Switch PCB<\/a>, and one with 4K or 8K video switching, never go to a factory that has not made high-speed backplanes, because they cannot understand how anxious you are about signal integrity.<\/p>

What a Real High-Speed and HDI Supplier Does Differently<\/h2>

Later I switched to a supplier that specialized in high-speed boards and HDI boards, and only then did I know where the gap was. From the start, they get involved in stackup design, suggesting which layer should carry the high-speed differential pairs, how to lay the reference layers, and even thoughtfully reminding you which high-speed board material has a smaller glass weave effect. This kind of high speed PCB manufacturer has a unit price about 20% higher, but the tested eye diagram opens wide, insertion loss and return loss are both ample, and the switching chip’s equalization can basically recover the clock without much effort.<\/p>

Switching Transients Are the Real Cause of Black and Garbled Screens<\/h2>

Speaking of this, I have to mention the switching action of a KVM itself. Many people think switching is just a matrix switch selecting one path and done, but in front of high-speed digital signals, the transient impedance mutation and ground bounce at the instant of switching are the real culprits of black screens and garbled screens. If the PCB design does not rely on multilayer stackup and build ground via arrays beside the signals to manage the return path, then every switch goes black once, or a few microseconds of clock lock loss occurs in the gap of signal switching, and the monitor has to re-handshake. This experience is unacceptable in a control room scenario. So now, when I draw KVM boards for my team, I start with at least 8 layers, with all high-speed differential pairs routed on inner layers and adjacent layers that must be complete reference planes. For this kind of prototyping, I only dare to send it to a multilayer board supplier I have worked with several times.<\/p>

USB Switching and Dense BGA Boards<\/h2>

Another fairly practical problem is that when a KVM needs to do USB 2.0 or even USB 3.0 switching, the differential lines and terminations on the PCB become more sensitive. Once, for convenience, I found a small factory that also did HDI, and the crosstalk between the SuperSpeed differential lines of USB 3.0 was too large, with the keyboard and mouse occasionally dropping. After switching to a supplier specializing in HDI boards, they used laser blind vias to reduce layer-change loss and could achieve intra-pair length matching of plus or minus 2mil, and the problem disappeared immediately. Since then, whenever a board has fine-pitch BGA or a back drilling need, I fix on two or three HDI pcb suppliers for mass production.<\/p>

Chips Decide Function, PCBs Decide Whether It Runs Stably<\/h2>

Ultimately, hardware people sooner or later understand one principle: the chip decides the upper limit of function, and the PCB decides whether it can run through stably. A KVM switch that switches images cleanly, plugs and plays the keyboard and mouse, and switches without flicker has the board’s line width, spacing, dielectric and stackup all quietly working hard. Rather than agonizing over ADI or TI in the solution, it is better first to get familiar with that reliable multilayer pcb supplier. When you are debugging deep in the night in the lab and cannot get a signal, it is often an impedance test report and a cross-section analysis from the board factory that can truly end the debug for you.<\/p>

Lessons from a 4-In 1-Out KVM Box<\/h2>

Some time ago I made a 4-in 1-out small KVM box with the board area pressed very tight, which nearly made me step in a pit in choosing a multilayer pcb supplier. Many people think a KVM has no difficulty, just a few chips cutting video signals back and forth, but once you lay out the PCB you find that on this small board, any layout mistake in the switch and crosspoint part can make crosstalk make you doubt life. I first found a general multilayer pcb manufacturer, and the impedance dispersion of the prototype boards was severe. When the crosspoint switch switched, the lower right corner of the monitor began to pull lines, and the eye diagram was uncomfortable even when open.<\/p>

Later a colleague introduced a factory that did high speed PCB manufacturing, and after re-stacking as a six-layer board, the signal stabilized. But after that I also learned: a KVM Switch PCB is not just about layer count. You have to see whether the factory is sensitive to things like differential pair length matching and reference layer integrity. Especially at places like the crosspoint, if one line is not handled well, the switching delay immediately increases by several milliseconds, the keyboard and mouse lag along with it, and the issue of enumeration loss when plugging and unplugging devices cannot be avoided.<\/p>

Now that I want to shrink the product size further, I have started touching hdi pcb suppliers, but it is troublesome to select an hdi pcb manufacturer<\/a> that truly understands HDI for KVM. Some factories have sufficient capability for laser via drilling, but their stacked via schemes show timidity once matched to signal rate, so I would rather spend a bit more and find one that has made similar products. In plain words, choosing a multilayer pcb supplier for this kind of board is choosing an attitude toward solving problems, not just competing on unit price, and half of whether the switch works crisply lies in the hands of the board factory.<\/p>

What Good KVM Boards Look Like Inside<\/h2>

I have disassembled no fewer than ten KVM switches, from plastic boxes of a hundred-odd yuan to metal-shell devices of over a thousand, and the difference in PCB routing inside is outrageous. Some cheap schemes make the monitor go black for two seconds at the instant of switching, which is not at all about slow protocol handshakes but that the few HDMI differential lines on the board have no impedance control, and the eye diagram collapses once the signal passes through the analog switch.<\/p>

Now when I choose a KVM switch, I do not first look at how many inputs and outputs it supports, but directly ask customer service for photos of the internal boards. If I can find a model that uses a multilayer board and explicitly marks the controlled impedance stackup, it is basically half reliable. An ordinary double-sided board has difficulty making TMDS differential pairs consistent at 100 ohms, especially when you have to do a physical switch between two or four inputs, and the routing inevitably turns corners and changes layers, so reflections and crosstalk arrive. So I would rather pay a bit more for a good PCB, as this board is the true value anchor of the whole switch.<\/p>

Last year I planned to make a small batch of a 4-in 1-out HDMI switch box myself, running 4K60 4:4:4. The schematic can be built following the reference design, and the hard part is how to make the PCB right. I looked for several factories that claimed to supply multilayer boards, and when I asked about high-speed design guidelines, many could not even explain the correspondence between interlayer dielectric thickness and differential line width. Later I switched to one specializing in high-speed PCB manufacturing<\/a>, who directly gave me a stackup scheme using low-loss FR-4 and high-Tg board material, putting all critical HDMI paths on inner layers wrapped above and below by complete ground layers, with vias also back-drilled as much as possible. Although cost doubled, the measured eye diagram opening was completely different.<\/p>

A friend of mine who does HDI PCB manufacturing told me that a scenario like KVM switching is actually quite suitable for HDI boards. Connectors are dense and line pitch is narrow, and first-order or second-order blind and buried vias can make the signal path shorter. From the switching chip to the output end the signal runs on surface microstrip and then goes immediately into an inner layer, so the parasitic parameters of the whole link can be much smaller. It is just that few small factories are willing to invest this much, and many squeeze everything onto a conventional four-layer board.<\/p>

I also stumbled when cooperating with multilayer board suppliers. One factory’s first prototype delivery had an impedance test report that looked beautiful, but the measured result showed obviously increased signal jitter after switching channels. Finally we traced it to their poor grounding of the thermal pad under the switching chip, so that a large number of return paths went around a long way and coupled noise straight into the clock. Since then I have learned: every time I review Gerbers, I certainly check the power tree of the switch and the return ground via layout separately.<\/p>

Ultimately, in the low-speed era HDMI switching could get by with relays, but once the rate is running at several Gbps, the PCB is the core component. A carefully designed KVM Switch PCB can make picture switching as crisp as turning a page, while a perfunctory board only makes you suspect the cables and monitor have a problem. My habit now is that when I get a new switch, I do not do a long-cable test first but take a look at the output eye diagram with a sampling oscilloscope. Whether the board is good, the waveform is more honest than any parameter.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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DisplayPort HBR3, Low-Loss Material and Back Drilling<\/h2>

In tinkering with this KVM switch project, I changed board factories no fewer than four times, and the pits I stepped in are enough to fill a memo. Many people think this thing is just cutting several USB and video signals back and forth and that a double-layer board will handle it, but when you actually start you know ordinary processes simply cannot hold up. Especially when you need to run 8.1Gbps DisplayPort HBR3 and a pile of high-speed USB signals at the same time, the board itself becomes the biggest uncertainty.<\/p>

The first multilayer pcb manufacturer I found had a cheap quote, but their conventional FR-4 attenuated outrageously above 5GHz, the eye diagram was a mess, and when pressing the switch button, desktop icons would even flash. Later I understood that on those traces on the KVM Switch PCB from the input connector to the switching chip, even if only two inches long, if the dielectric constant is unstable, the insertion loss rounds off the signal edges. This loss cannot be solved by brute-forcing it with drive capability. You must change to low-loss board material and also control via stubs. My practice now is that for parts involving ultra-high-speed differential pairs, I directly require back drilling and give the board factory no room for negotiation, because even a few dozen mils of residual stub is a resonant cavity at 8Gbps rate, and the notch popping up in the spectrum can eat one third of the eye height.<\/p>

The pits on the USB side are an entirely different matter. At the instant of switching, it is not simply a matter of flipping the physical path over. Most cheap KVMs make downstream devices go through a short disconnect during switching, which on Windows may just pop up an unrecognized device notice in the lower right corner, but in the BIOS stage of some server motherboards the keyboard loses contact directly and you must reboot to re-enumerate. The essence of this problem lies not in how fast the switching chip is but in whether it can always maintain a live USB HID descriptor for each host. To solve this I specially tried several MCUs supporting True DDM, which is equivalent to virtualizing resident keyboard and mouse entities inside the KVM, redirecting commands to them at switching time, with no interruption at the electrical layer. This logic has larger constraints on PCB layout than imagined, because the power supply of the emulation chip must be independent and clean, and if it shares one 3.3V rail with the video switch array and decoupling is sloppy, periodic power supply noise will overlay the USB signal eye diagram, with enumeration occasionally dropping when plugging in a USB drive.<\/p>

The hdi pcb manufacturer that made the boards for me later suggested routing the USB emulation unit and the video switch matrix on separate layers, burying critical differential pairs on inner layers sandwiched between complete reference planes, and then fanning out with laser blind vias. The cost of this approach is a step higher, but it did solve the crosstalk problem. In the past, on the test bench I would plug a wireless mouse receiver and a UVC camera in at the same time for switching, and the mouse would stutter for half a second, simply because the 2.4GHz induced noise of the receiver crept into the adjacent USB D+ D- traces. After changing to a blind and buried via structure, with analog and digital ground joined at a single point in the multilayer stackup, this phenomenon disappeared.<\/p>

Speaking of selecting suppliers, I think for a project like KVM that is small-batch but demanding, you cannot just look at whether a factory has the high speed PCB manufacturer label. You have to look specifically at their track record in handling mixed signals. The multilayer pcb supplier<\/a> I permanently work with proactively proposed from the start that the USB 3.0 signals in my design use the process of removing non-functional pads and made separate test coupons for impedance. The accumulation of these small things is what moved the eye diagram template margin of the switch from barely passing certification to more than 15% margin. And for an hdi pcb supplier that is unwilling even to explain stub calculation and dielectric constant frequency shift, I will not go back however low the quote, because whether a KVM switch can ultimately be used and used well depends not on the parameters written in the chip manual but on how solid the signal integrity of the board itself is.<\/p>

EDID Stability Matters More Than USB Speed<\/h2>

Many years ago, to save desktop space, I bought a KVM switch and was tortured by its six- or seven-second black screen. At that time I did not think of disassembling it to study it, until recently when I built a small multi-computer switching box myself and found that this has less to do with how fast USB runs, and what is more critical is whether EDID is given steadily.<\/p>

Some schemes on the market like to talk up that integrated chip, stuffing USB switching, HID emulation and switch control all into one part, as if that makes KVM Switch PCB design foolproof. In fact, once routing gets dense, to really run USB 3.0 at 5Gbps, even if the chip itself supports it, the layout is enough to make you drink a pot. The several pairs of SSTX+ and SSTX- differential lines must be strictly controlled at 90 ohm impedance, and they must also be separated from the intrinsically fragile full-speed D+ and D- signals, otherwise when high-speed data runs, the mouse and keyboard act up. I prototyped twice on a double-layer board and flipped both times, and only after I honestly switched to a multilayer board factory to redo it did I understand that this thing cannot save on layers. If the multilayer pcb supplier you find has no experience with impedance control of this high-speed differential pair, the boards that come out are basically decorations.<\/p>

Digging deeper, many factories claiming to be able to make HDI PCBs have in fact only solved the physical problem of line width and spacing and simply do not understand the signal integrity requirements of this kind of switching board. When I was looking for an hdi pcb manufacturer, I deliberately asked whether they could do 0.2mm blind holes and control whole-board impedance within plus or minus 10%, and one question about process capability filtered out more than half. Later, through a friend, I contacted a high speed pcb manufacturer that started with optical module backplanes. They had cut signals of dozens of Gbps and truly had confidence in this few-GHz USB switching. Before placing the order, I specifically stressed that this KVM board is not an ordinary one-to-many hub, and it needs to support the logic of two host ends simultaneously recognizing one set of peripherals, so the stackup must clamp the power and ground layers close enough, otherwise when instantaneous current collapses, the virtualized keyboard and mouse lose enumeration on the host side.<\/p>

Speaking of enumeration, this is what I think is currently the most seriously neglected thing. Most people think KVM switching is just selecting the physical path, but if you rely only on a chip like the AX68002 for hard switching, the EDID part is often under-considered. I have tested no fewer than five dual-port KVMs of a few hundred yuan, and when switching from one host to another, the reason the monitor goes black for so long is not at all that video signal rebuilding needs time, but that the system thinks you disconnected the monitor and goes through the DDC handshake again. The killer is that some engineering boards bundle the DDC SDA and SCL together with the USB signal and switch them together, without considering at all keeping a virtual monitor for the host during the switching gap. Later I built a small module myself, using an MCU to cache the EDID of both hosts, and at the moment before switching forcibly stuffing a valid EDID data block to the other side with eyes closed, confirming negotiation passes before switching the video channel, so that the screen going black is almost instantaneous, under one second.<\/p>

Looking back finally, making a multi-port switching KVM Switch PCB does not require superstition about any single vendor’s reference design. The core is rather to weigh together three nodes: high-speed signal switching, state emulation toward the host side, and PCB process. If the board is not made well, even the best USB switching chip is useless. If EDID is not handled neatly, however beautiful the stackup, what users see is still a long black screen. No multilayer pcb supplier will proactively tell you these things. Only if you work through the logic yourself do you know which parameters to watch closely when communicating with the board factory.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Do You Really Need EDID Emulation? A Counter-View<\/h2>

Tinkering with KVM switches, in fact the worries of most people are not the device itself but how the invisible cables and the small KVM Switch PCB behind them handle signals. For a long time I wrestled with black screens, where switching a signal made the monitor go black for several seconds, and later I found it was not at all slow EDID handshake but purely poor impedance matching in PCB routing, with the eye diagram a mess. I took that board apart and showed it to a buddy who does high-speed PCBs, and he shook his head straight away: the circuit turned corners around and was not handled well, the differential pairs were twisted and crooked, never mind 4K, running 1080P would be a struggle. Later I redrew a version myself, found a factory specialized as a high speed PCB manufacturer to prototype, bypassing those factories that call themselves hdi pcb manufacturers but have actually only made a few multi-order boards, and after soldering the stuff that came back, the picture switching was much crisper. Many people worship EDID emulation and solder large storage chips onto it, but actually monitors are smart enough, and as long as the channel is clean, no emulation is needed at all, with the signal passing straight through and done.<\/p>

People who are willing to spend on a KVM are usually not worried about cost but about whether the multilayer board stackup is stable. Earlier I went cheap and found a multilayer pcb supplier that had piled up a four-layer board quite perfunctorily, with an incomplete ground plane, and video signals occasionally flashed stripes. Later I switched to a slightly more expensive multilayer pcb manufacturer that went straight to six layers, dedicating one layer to a complete reference ground, and only then did the eye diagram of the HDMI-to-DVI part become clean. As for those who insist on distinguishing an hdi pcb supplier, if you have not used extremely fine-pitch BGA, there is really no need to go to laser drilling, and a general mechanically drilled eight-layer board is enough to run 4K60. A KVM, in the end, is seventy percent about the PCB’s RF performance when it is good, and the rest is the EDID handshake logic. Do not be confused by flashy emulation functions: when the board is clean, the monitor is quiet.<\/p>

Reference Planes, Crosstalk and Why Layer Count Cannot Be Saved<\/h2>

After several years making KVM switch hardware, looking back, what really gives people a headache has never been the schematic but pressing signal integrity and cost down at the same time. Especially for a multi-port KVM Switch PCB with HDMI 2.0 and USB 3.0, you must handle 100 ohm differential, 90 ohm differential on a very small board, and leave a way out for 75 ohm VGA. The stackup and impedance alone can drag the project cycle down.<\/p>

The deepest pit I stepped in early on was underestimating the continuity of the reference plane. On one four-layer board, to save a bit of money I found a multilayer pcb supplier that did not communicate much. The impedance table looked fine, but when it came back and was measured the eye diagram collapsed directly. Later, cutting lines and jumpering to troubleshoot, I found that a piece of copper under the video switching chip had been chopped to bits by a via array, the return path took a long detour, and ground bounce tossed the TMDS differential pins around terribly. After that I learned my lesson: even for the simplest stackup, I run a field solver myself, and I cannot just look at the impedance calculation template given by the factory.<\/p>

Now when I plan a solution I directly require the board factory to use designated high-speed material, and even for just a few sample boards I find a high-speed PCB manufacturer that can really do impedance testing to cooperate. Especially when the KVM board also carries a USB 3.0 hub and an Ethernet PHY, crosstalk between differential pairs cannot be solved by widening spacing in layout. One time, to separate the two groups of 100 ohm differential pairs of USB and HDMI, I stuffed a ground copper strip between them, but the ground copper strip did not have enough vias, and near-end crosstalk on the 6GHz segment was still minus 28dB, so I had to redo it. Later I switched to an HDI PCB supplier that buried the high-speed lines into inner layers with two-step blind vias, leaving only low-speed control lines on the outer layers, and the EMI immediately became clean, and even the shield can could be made a bit lower.<\/p>

Some people think HDI boards cost too much, but if you count yield, rework hours and extra shielding material, conventional multilayer boards may not be cost-effective. What I fear most now is that kind of multilayer board manufacturer claiming to be able to do anything, and when you ask for an impedance test report they say we adjust by experience, which basically equals blind tuning. For a proper KVM Switch PCB, once the stackup is determined, impedance control must be traceable all the way from Gerber to finished product, with which batch’s dielectric thickness drifted and which model’s PP was changed all being clear. Otherwise, on the dozens of differential pairs of an 8-port 4K KVM, if one or two ports cannot run at high resolution, customers will only feel your product is no good and will not care that the board material fluctuated 0.1 in dielectric constant.<\/p>

Many times what torments people is not theory but the supply chain. A stable multilayer board supplier is much more useful than a pile of technical documents. They can tell you which glass cloth suits your differential line spacing and which copper foil roughness will not eat the signal at 18Gbps. These things cannot be learned from flipping through industry notes online. They can only be accumulated slowly from repeated prototyping and failure analysis.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Testing Beyond the Press-the-Button Check<\/h2>

During the time I was making KVM switches, I stepped on all the pits of the PCB. At the beginning I always felt the core was in the chips. I picked retimers and crosspoint switches for a long time, but when the board came back and was measured, the signal kept collapsing, and after two months of chasing I found the source was the carrier itself: the design and processing of that KVM Switch PCB is much more fragile than you imagine.<\/p>

Many people do not realize that switching inside a KVM is a completely different thing from ordinary digital routing. It requires maintaining end-to-end impedance continuity while switching high-speed video and USB among several hosts. If you let an ordinary multilayer pcb manufacturer who has not played with high-density interconnect make it, what comes out is very likely a mess on the eye diagram. We tried a volume factory with a very low quote, and the USB 3.0 link had a severe undershoot at the instant of switching, and after changing several ESD devices it could not be pressed down. In the end we gritted our teeth and went to an hdi pcb manufacturer. After this change, the layer structure went from a conventional through-hole board to stacked holes plus microblind vias, the ground plane became complete, and only then was that glitch cut from 900mV to under 300mV.<\/p>

However, finding the right supplier is not only about technical reputation. Some factories claiming to do HDI answer eagerly when taking orders, but on the real production line, their laser drilling alignment is outrageously off, causing intra-pair skew of differential pairs to soar to a dozen-plus picoseconds. We lost a whole batch of four-layer boards because of this, and later noticed that those suppliers that only stick HDI on as a label and the hdi pcb suppliers that truly treat high-density interconnect as the staple food differ essentially. The latter give more detail than needed on impedance coupon test reports, even marking the dielectric constant shift at different temperatures, which is truly reassuring for high-speed routing.<\/p>

Besides finding the right high-speed PCB manufacturer, the testing link cannot go through the motions either. The classic problem of a KVM is that nothing goes wrong at the switching instant, but after running for several hours it begins to flicker or drop USB devices, especially in hot-plug simulation. Later we built our own set of fixtures, not simply pressing buttons by hand but using a CPLD to simulate crazy switching, cooperating with a logic analyzer to capture USB enumeration frames while monitoring the clock embedded in HDMI with a sampling oscilloscope. The problem found was interesting: once EDID read repeatedly timed out, and you would think the software crashed, but actually the board factory had routed a DDC trace across a split slot, causing a ground loop. This kind of fault cannot be located unless you run every switching path from start to finish.<\/p>

So my view of this whole KVM business is quite blunt: do not underestimate PCB engineering itself. Which port to switch to is intuitive, but every millivolt of margin in the signal is built up by a reliable multilayer board supplier and rigorous testing. However strong your switching topology, when you meet a board with ground bounce out of control, you still have to obediently redo it. Pick a partner who can backstop high-speed signals, and pair it with a test flow covering all paths, which is more practical than anything.<\/p>

USB Emulation, EDID Memory and HDI for Rack Trays<\/h2>

Some time ago I helped a friend build a 4-in 1-out video switch box. At that time I did not think deeply and figured I just needed to find a multilayer board factory to pull through several high-speed signals. When the first batch of boards came back, HDMI 2.0 went garbled directly after passing through the switching chip, and after checking for a long while I found the stackup parameters given by that multilayer pcb supplier simply could not support rates above 6Gbps, and the impedance of the differential pairs was off to who knows where. Later, on re-prototyping, I honestly found a factory that specialized as a high speed PCB manufacturer, and went to confirm the stackup with a test report from a vector network analyzer, and only then did the eye diagram open.<\/p>

What tormented me most on that KVM Switch PCB was not routing but the reaction of each host at the instant of switching. With ordinary USB switching chips for the keyboard and mouse, at the instant of switching over, the host always thought the device had been unplugged and re-enumerated, and in the BIOS it often hung and could not enter setup. Later I simply abandoned that conventional analog switch approach and stuffed a separate emulation chip at each input end, always keeping the keyboard and mouse state online, so that whichever host it switched to, it felt the device had never disconnected. The pit of this emulation is hard to appreciate for those who have not stepped in it: the trouble saved in software is all piled into hardware cost, but it is indeed worth it.<\/p>

The EDID problem is more hidden. In the early days, to save trouble, I directly switched the monitor’s EDID over I2C, thinking the host would just re-read the screen parameters when switching. The result was that every input switch caused a black screen of three or four seconds, with the monitor handshaking repeatedly and resolution occasionally jumping to strange values. Later I learned that even a fan spinning a bit faster would produce glitches on the I2C line and interrupt the reading process. In the end, I hung a separate EDID emulation memory on each input port, solidifying all screen parameters inside in advance, so that at the instant of switching, the host reads the locally emulated EDID and does not need to communicate with the remote monitor at all. Switching delay dropped directly to under half a second, and the black screen feel was nearly gone. Moreover, with multiple outputs, extra EDID address switching logic is needed so that the DDC channels of several hosts do not fight, which is much more complicated than imagined.<\/p>

From the board manufacturing angle, when I got to the second generation and wanted to shrink the volume to fit into a corner of a standard rack tray, an ordinary through-hole board could no longer route it. Only then did I contact an hdi pcb supplier, changing the video matrix part to 2-step HDI, with laser blind vias drilled directly in the fan-out area of the processor BGA. The advice given by that hdi pcb manufacturer was very practical: they insisted that a complete reference ground plane must be kept under the switching chip and that the ground could not be split for routing, otherwise the return path of high-speed serial signals gets messy and the low crosstalk metrics are all ruined. This requirement made routing take three more days, but when passing the conformance test later there was no ambiguity at all.<\/p>

Looking back at this now, I feel that for equipment used to switch frequently among multiple hosts, relying on a high-spec main chip is useless. The board factory’s control of interlayer dielectric thickness consistency and its understanding of simulated signal integrity are the watershed between success and failure. Do not count on just any multilayer pcb manufacturer to backstop you. Those hdi pcb suppliers and high-speed board factories that can truly ship stably have process data in hand that is much thicker than what is on our schematics.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

Building a KVM Switch PCB? Learn how controlled impedance, stackup, HDI, and EDID\/USB emulation prevent black screens, flicker, and dropped keyboards, and how to choose a PCB supplier.<\/p>","protected":false},"author":1,"featured_media":11663,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[51],"tags":[],"class_list":["post-11740","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blogs"],"yoast_head":"\nKVM Switch PCB Design: Signal Integrity, EDID and USB Emulation Tips for Glitch-Free 4K Switching<\/title>\n<meta name=\"description\" content=\"Building a KVM Switch PCB? 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