1.0Grupo Sprintpcbhttps://www.sprintpcbgroup.com/essprintpcbgrouphttps://www.sprintpcbgroup.com/es/author/sprintpcbgroup/Why Process Details Matter in Rogers PCB Material Selectionrich600338<blockquote class="wp-embedded-content" data-secret="gwvgPbFXNQ"><a href="https://www.sprintpcbgroup.com/es/blogs/rogers-pcb-high-frequency-technical-guide/">Why Process Details Matter in Rogers PCB Material Selection</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.sprintpcbgroup.com/es/blogs/rogers-pcb-high-frequency-technical-guide/embed/#?secret=gwvgPbFXNQ" width="600" height="338" title="«Why Process Details Matter in Rogers PCB Material Selection» — SprintpcbGroup" data-secret="gwvgPbFXNQ" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script>
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</script>https://www.sprintpcbgroup.com/wp-content/uploads/2026/01/rogers-pcb-high-frequency-material-engineering-board.webp500500During high-frequency circuit board debugging, it was discovered that even with Rogers PCB materials of the same specifications, subtle differences exist in signal performance across different batches in the millimeter-wave frequency range. For example, some boards exhibit additional loss at 77GHz, often stemming from variations in glass fiber weave density or temperature and humidity control during manufacturing. This article, using a 5G base station project as a case study, explores the impact of manufacturing processes on dielectric constant stability, reminding engineers to pay attention to details beyond material parameters.