{"version":"1.0","provider_name":"SprintpcbGroup","provider_url":"https:\/\/www.sprintpcbgroup.com\/de","author_name":"sprintpcbgroup","author_url":"https:\/\/www.sprintpcbgroup.com\/de\/author\/sprintpcbgroup\/","title":"Learning from Failure: Material Pitfalls in Hybrid PCB DesignWhy does the performance of hybrid PCBs always suffer during the manufacturing process?","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"nOfHKwW8xq\"><a href=\"https:\/\/www.sprintpcbgroup.com\/de\/blogs\/hybrid-pcb-design-material-pitfalls\/\">Learning from Failure: Material Pitfalls in Hybrid PCB DesignWhy does the performance of hybrid PCBs always suffer during the manufacturing process?<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.sprintpcbgroup.com\/de\/blogs\/hybrid-pcb-design-material-pitfalls\/embed\/#?secret=nOfHKwW8xq\" width=\"600\" height=\"338\" title=\"&#8222;Learning from Failure: Material Pitfalls in Hybrid PCB DesignWhy does the performance of hybrid PCBs always suffer during the manufacturing process?&#8220; &#8211; SprintpcbGroup\" data-secret=\"nOfHKwW8xq\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script>\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/www.sprintpcbgroup.com\/wp-includes\/js\/wp-embed.min.js\n<\/script>","thumbnail_url":"https:\/\/www.sprintpcbgroup.com\/wp-content\/uploads\/2026\/01\/hybrid-pcb-engineering-design.webp","thumbnail_width":500,"thumbnail_height":500,"description":"Having worked in RF hybrid PCB design for many years, my deepest realization is that material properties determine the success or failure of the manufacturing process. From abnormal drill bit wear when drilling PTFE substrates, to prepreg overflow during multilayer board lamination, to controlled-depth milling almost cutting through the signal layer\u2014each pitfall reminds us that hybrid PCB manufacturing is far more complex than simply drawing a design. Spending half a day researching material and process compatibility is more valuable than blindly designing, and can help avoid the embarrassment of three weeks of rework."}