{"id":9136,"date":"2026-07-16T15:01:00","date_gmt":"2026-07-16T07:01:00","guid":{"rendered":"https:\/\/www.sprintpcbgroup.com\/?p=9136"},"modified":"2026-07-13T15:40:39","modified_gmt":"2026-07-13T07:40:39","slug":"how-solving-castellated-pcb-half-hole-soldering","status":"publish","type":"post","link":"https:\/\/www.sprintpcbgroup.com\/ar\/blogs\/how-solving-castellated-pcb-half-hole-soldering\/","title":{"rendered":"Solving Common Half-Hole Soldering Problems in Castellated PCB Design"},"content":{"rendered":"
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I’ve seen many engineers stumble on half-hole treatment when designing Castellated PCBs<\/a>. Those seemingly neatly arranged semi-circular notches actually hide many intricacies.<\/p>

I remember once helping a friend check the design drawings of a communication module. At first glance, the arrangement of the half-holes along the board’s edge looked beautiful. However, during actual soldering, I found that the solder couldn’t adhere to several locations. Upon closer inspection, I discovered the problem lay in the design of the copper rings around the half-holes\u2014too little copper foil was retained near the board edge.<\/p>

Many people think that simply aligning the drilled holes with the board’s edge cut line is enough. The real key is whether the remaining structure after cutting can form an effective solder surface. Specifically, the width of the copper ring retained after cutting the half-hole should be at least 0.15mm, and it needs to completely wrap around the hole wall 360 degrees to form a reliable solder wetting angle. If the copper ring is too narrow or has gaps, the surface tension cannot support the solder to form a complete meniscus.<\/p>

I once had an interesting test on the impact of different surface treatments on half-hole soldering. The same design was treated with both ENIG and immersion silver processes. The results showed that the soldering performance of the immersion silver-treated board deteriorated significantly after being stored in a humid environment for two weeks. This is because the silver layer reacts with sulfides in a humid environment to form silver sulfide, leading to decreased solderability. The gold layer in the ENIG process better protects the nickel layer from oxidation, but it’s crucial to control the gold layer thickness within the 0.05-0.1\u03bcm range. An excessively thick gold layer can lead to brittleness and affect solder joint reliability.<\/p>

I think the most easily overlooked aspect is the size control of the solder mask opening.<\/p>

Sometimes, for aesthetic reasons, the solder mask opening is made extremely precise, perfectly covering the pad. However, in actual production, even small alignment deviations can cause the solder mask to cover part of the soldering area. It’s recommended that each side of the solder mask opening be 0.05-0.1mm larger than the pad. This ensures that even with an alignment error of \u00b10.05mm, the soldering area is fully exposed. This allowance is especially critical when using fine half-vias with a pitch of 0.4mm or less.<\/p>

I prefer to leave sufficient allowance for the solder mask opening, especially in areas prone to misalignment, such as the board edges.<\/p>

Another common misconception is the oversimplification of the half-via function.<\/p>

Some people think it’s just a mechanically fixed structure, but these semi-circular notches actually serve a dual purpose: electrical connection and mechanical anchoring. For example, in high-speed signal transmission, the impedance continuity at the half-hole affects signal integrity, requiring appropriate distance from the reference layer to control impedance. Mechanically, the anchoring effect of the half-hole is directly related to the copper thickness of the hole wall; a copper thickness of 18\u03bcm or more is recommended to ensure sufficient tensile strength.<\/p>

I’ve seen designs where adjacent half-holes are spaced too close together, resulting in molten solder bridging the two holes during wave soldering. Based on experience, the center-to-center spacing of the half-holes should be at least 1.5 times the hole diameter, taking into account the range of solder surface tension. For half-holes with a diameter of 0.8mm, a spacing of at least 1.2mm is recommended, with a solder mask bridge placed in the middle for isolation.<\/p>

Now, during design reviews, I pay special attention to the relative positions of the half-holes to other components.<\/p>

Recently, a smart home module design impressed me; they cleverly placed the half-holes on both sides of the connector, ensuring structural strength while avoiding the risk of bridging during soldering. The specific approach involves maintaining a distance of at least 2mm between the half-hole and the connector pads, and placing a thermal relief pattern in between. This avoids excessive heat conduction affecting soldering and prevents solder migration. Even more ingeniously, they utilize the half-hole as a test point, achieving online testing functionality through a special window design.<\/p>

This consideration of actual manufacturing processes is what truly constitutes good design.<\/p>

Ultimately, the success of a Castellanated PCB often depends on seemingly insignificant details. For example, the distance between the half-hole and the board edge must be controlled within the range of 0.2-0.3mm; too close and the copper trace will tear during cutting, while too far and the soldering strength will be compromised. Drilling quality is also crucial; the hole walls must be smooth and burr-free. These all require thorough communication with the PCB manufacturer to clarify process requirements and acceptance standards.<\/p>

I recently encountered a rather interesting problem while designing a communication module\u2014a story about Castellanated PCBs. To save space, I chose this half-hole edge design, but several pins developed cold solder joints during soldering.<\/p>

Later, upon examining the board under a microscope, we discovered a minute copper layer peeling off the edge of one of the half-holes. This problem is extremely subtle, invisible to the naked eye, yet the solder couldn’t completely cover the contact surface during soldering. After repeated experiments, our team found the issue lay in the post-drilling processing\u2014ordinary deburring was too harsh on the half-hole structure, easily damaging critical conductive areas.<\/p>

Now, for these types of designs, I always carefully instruct the manufacturer to treat the half-holes at the board edges specially. For example, controlling the milling cutter speed to avoid the heat generated during high-speed cutting affecting the plating quality. Another tip is to leave sufficient margin during the design phase, keeping critical signal lines away from the cut areas at the board edges.<\/p>

This type of problem is even more pronounced on multilayer boards<\/a>. Once, while debugging a six-layer board, we found a break in the power plane at the half-hole location on the inner layer. We later realized this was due to differences in the thermal expansion coefficients of the layers, causing a slight displacement during high-temperature soldering. Therefore, for designs requiring high current carrying capacity, I now request the manufacturer to increase the copper layer thickness in these areas.<\/p>

Sometimes, hardware design feels like performing surgery; every detail must be meticulously considered. Especially when dealing with high-frequency signals or power circuits, the advantages of castellated PCBs are undeniable, but mishandling these details can actually create more problems.<\/p>

I now routinely conduct a design review before each version is released, focusing on structural components prone to issues. Although it takes an extra half-day, it’s far more worthwhile than the frantic debugging later on. After all, the worst thing in hardware design is dealing with these seemingly simple yet intricate details.<\/p>

By the way, I recently saw a clever approach\u2014a company implemented special solder mask treatment on the half-hole areas along the board’s edge, ensuring soldering reliability while avoiding residue issues during subsequent cleaning. These practical innovations are often more valuable than textbook theories.<\/p>

Ultimately, good designs are built on experience gained through trial and error. Learning something new every time you encounter a problem is probably the greatest joy for a hardware engineer.<\/p>

I’ve always felt that the most easily overlooked details in circuit board design are those seemingly insignificant edge treatments. In one project I was in charge of, we used Castellan PCBs. We initially thought this design with half-holes would simplify assembly, but it almost caused a disaster during mass production. The production line reported several batches of boards exhibiting signal anomalies. Upon inspection, we discovered the problem stemmed from substandard copper foil treatment at the edges of the half-holes.<\/p>

You probably can’t imagine how much trouble those tiny metal protrusions can cause. The board material we used was relatively soft. When the milling cutter passed through, the copper layer edges easily curled up, forming burrs. These seemingly insignificant protrusions can act as hidden traps during soldering. One case was particularly typical: after disassembling a returned module, we found that the burrs at the half-hole had fused with the adjacent pads. Although it passed factory testing, the vibrations during transport caused them to come into complete contact, resulting in a short circuit.<\/p>

Even more troublesome is that these problems often don’t surface immediately. I’ve seen some devices only develop intermittent malfunctions after three months of use. Upon disassembly, we found that the burrs at the half-hole had gradually deformed due to temperature changes, eventually puncturing the insulation layer. This slow deterioration process is far more troublesome than a direct short circuit.<\/p>

Now, whenever I inspect these boards, I pay special attention to the smoothness of the hole walls. Sometimes, even a light rub of the edge with a glove reveals a rough texture. This indicates the burrs are large enough to require rework. Good processing plants will add a deburring process after milling, such as brushing with soft abrasives or micro-etching. Although this is more expensive, it avoids many subsequent problems.<\/p>

Actually, there’s a very intuitive way to judge the processing effect: look at the reflection at the edge of the half-hole against the light to see if it’s continuous. If you see jagged bright lines, it means the metal burrs haven’t been completely removed. This simple method has helped us stop many potentially problematic batches.<\/p>

A new process we’ve recently tried involves leaving a larger isolation zone around the half-hole during the design phase. This is equivalent to providing a safe distance for potential burrs. Although it sacrifices some layout space, it improves long-term reliability. This is probably a case of learning from experience.<\/p>

Ultimately, these details test the level of coordination between the design and manufacturing processes. Even the most perfect Castellat design on paper still depends on the processing plant’s control over the actual product.<\/p>

While tidying up my studio recently, I came across several old PCBs with castellan edges. These boards with half-holes along the edges were particularly interesting. I remember when I first started working with this type of design, I was always worried that those tiny metallized edges might cause problems during soldering.<\/p>

Once, I designed a board that required a dozen or so half-holes arranged in a U-shape along the edges. The manufacturer suggested I keep the hole diameter above 0.mm. This size sounds small, but it’s actually a relatively safe choice in half-hole technology. After all, those metallized edges have to withstand two high-temperature tests.<\/p>

I’ve found that many people easily overlook the fact that the real value of these half-holes isn’t in saving space, but in providing reliable electrical connections. Especially when your design requires stacking multiple modules, those neatly arranged half-holes fit together precisely like mortise and tenon joints in architecture.<\/p>

A common misconception is that smaller half-holes indicate superior technology. In fact, I’ve seen many cases where pursuing extreme miniaturization backfired. In one project, they pushed the hole diameter to its limit, resulting in plating separation during the second reflow soldering. Later, we relaxed the dimensions to around 0.mm, and the problem was easily solved.<\/p>

Looking at these old boards now, I can still feel the joy of finding a balance between craftsmanship and innovation back then. Sometimes the most elegant designs aren’t the most complex, but rather those solutions that satisfy functionality while leaving ample room for manufacturing.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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I recently encountered something quite interesting while debugging a wireless communication module. The daughter card, designed with a Castellan PCB, was soldered perfectly, and the multimeter showed a connection, but it consistently lost packets during actual data transmission. This situation made me re-examine the seemingly simple half-hole connection technology.<\/p>

Many people think that these slotted PCBs are simply cutting a standard via in half, but what truly affects stability are often those easily overlooked details. For example, I once discovered that in high-humidity environments, some half-hole pads exhibited minute electrochemical migration. While not enough to completely break the circuit, it introduced noise into high-frequency signals. This problem doesn’t immediately surface; it often gradually becomes apparent after the device has been running for several weeks.<\/p>

Another common misconception is that simply increasing the amount of solder will improve reliability. In reality, excessive solder can mask the true contact problem. I prefer observing the solder climb height within a half-hole under a microscope. Sometimes, seemingly full solder joints may contain air gaps that gradually widen with temperature changes.<\/p>

Modern electronic devices have increasingly stringent space requirements, leading many engineers to choose ultra-thin sheet metal to reduce thickness. However, this choice can be disastrous for half-hole structures\u2014excessively thin sheet metal leads to stress concentration during cutting. I’ve encountered cases in my experiments where microcracks in the substrate caused long-term reliability degradation.<\/p>

What truly changed my design approach was a failure analysis report that revealed the root cause of poor contact originated from the electroplating process. When the half-hole cut penetrates the electroplating layer, improper process control can create burrs at the cut edge that are difficult to detect with the naked eye. These burrs gradually puncture the solder interface during thermal cycling.<\/p>

Now, when designing modules with half-holes, I pay particular attention to three dimensions: the compatibility of the sheet metal’s coefficient of thermal expansion with the motherboard, the ductility of the electroplating layer, and the setting of the soldering temperature profile. Sometimes, the key to solving problems lies not in pursuing more complex solutions, but in perfecting the fundamental processes.<\/p>

I recently encountered an interesting phenomenon while designing a project with a castellan PCB\u2014many people oversimplify the half-hole process. The biggest problem with this type of design, featuring semi-circular pads on the edges, is assuming the correct dimensions.<\/p>

A while ago, an engineer came to me with a design for a 0.3mm hole, saying the factory couldn’t get it right. I immediately understood the problem\u2014he thought he could simply apply the dimensions of a regular through-hole to a half-hole. In reality, when the milling cutter cuts off half the hole, if the hole diameter is too small, the copper foil simply can’t withstand the mechanical stress. I suggested he increase the hole diameter to 0.6mm or larger, and the yield rate immediately improved.<\/p>

Another easily overlooked detail: the relationship between the outer frame layer and the drill layer in the Gerber file. Once, during a review, I discovered the designer had drawn the outer frame line 0.1mm from the center of the drill hole, which resulted in an incomplete half-hole shape after cutting. The correct approach is to have the outer frame line pass directly through the center point of the drill hole, just like cutting a watermelon with a knife along the center line.<\/p>

Some manufacturers advertise that they can make 0.4mm half-holes, but I’ve tried it twice and found micro-cracks in the copper layer at the edges. It might be possible in a lab setting, but vibrations and temperature changes during mass production will expose the problems. Especially when the board needs to be soldered with other modules, thermal expansion and contraction will make the half-hole connection the weakest link.<\/p>

My preferred approach is to leave a safety gap of at least 0.8mm around the half-hole. Although this takes up more area, it avoids the risk of short circuits caused by conductive residue. I’ve seen cases where people compressed the gap to 0.4mm for a compact layout, resulting in the scrapping of an entire batch of boards.<\/p>

Actually, there’s a simple way to judge whether a half-hole design is reliable: Hold the cut surface up to the light; it should be a uniform arc shape; lightly scratching the edge with your fingernail shouldn’t leave copper powder; and under a magnifying glass, there shouldn’t be any hairline cracks at the joint between the pad and the substrate\u2014if all three conditions are met, the board can generally withstand a lifespan of more than three years.<\/p>

Having worked on half-hole PCBs<\/a> for years, I’ve come to realize that while they look simple, they’re fraught with pitfalls. I remember when I first encountered Castellan PCBs, I thought they were just ordinary boards with a few notches and slots.<\/p>

But when the samples arrived, I was stunned\u2014the edges of the half-holes were so rough they could scratch your hand. Later, I realized that this thing demands extremely precise manufacturing processes.<\/p>

The skill level of PCB manufacturers varies more than I imagined. Once, a new manufacturer I was working with readily agreed to no problems after I sent them the design files. When the actual product arrived, I found the half-hole position was off by 0.2 millimeters. While it may seem small, it’s enough to cause pin misalignment during soldering. Such minute deviations are invisible on drawings; only the actual product reveals the true skill.<\/p>

Now, I pay special attention to the details of how manufacturers handle half-holes. For example, what tools they use for milling, how they control the copper plating thickness\u2014these seemingly trivial points often determine success or failure. Experienced manufacturers will proactively offer improvement suggestions, such as adjusting the hole spacing to avoid stress concentration, rather than mechanically adhering to the design files.<\/p>

The importance of design specifications cannot be overstated. I habitually mark key dimensions on the drawings in bright red with accompanying text explanations. Although it takes an extra ten minutes, it saves a lot of trouble later on. After all, workers on the production line are dealing with dozens of orders; clear markings reduce the probability of errors.<\/p>

A recent project required soldering chips directly onto half-holes. I communicated with the manufacturer’s engineers three times before finalizing the solution. They suggested thickening the copper plating on the hole walls to twice the standard thickness, allowing molten solder to climb more effectively during soldering. This small change improved the yield rate by 30%.<\/p>

Finding a manufacturer is like finding a partner; focusing solely on price can lead to pitfalls. Now, I prioritize whether the other party is willing to spend time understanding the design intent. A good partner will work with you to refine the details rather than simply providing a quote. After all, creating a beautiful half-hole board requires seamless cooperation between design and manufacturing.<\/p>

Recently, while designing an IoT device, I reconsidered my PCB connection approach. Previously, I always thought pin headers were the safest option\u2014easy to plug and unplug, simple to test! But in actual mass production, the extra height and the risk of poor contact became a major headache.<\/p>

Later, I encountered a module design with metal semi-circular dots on the edges, and it all made sense. This structure, called Castellatized PCB, essentially uses specially shaped half-holes on the board edge as solder points to directly solder functional modules onto the motherboard like surface-mount components.<\/p>

I remember being quite apprehensive when I first tried this solution, worried about whether these tiny metal points could reliably connect. But the test results were unexpected\u2014not only was the signal integrity much better than pin headers, but the overall height was also reduced by 60%, which is a godsend for wearable device development.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Interestingly, the manufacturing process for these half-holes is much more complex than I imagined. Unlike regular through-holes where drilling is the end of the process, this requires copper plating followed by precision cutting to divide the hole in two. This reminded me of a project where neglecting the chamfer design of the half-hole led to short circuits during soldering.<\/p>

Now, when I do modular design, I prioritize this solution, especially for space-sensitive applications such as the connection between the motherboard and communication module in a smartwatch, or the connection between the drone’s flight controller and sensors.<\/p>

However, it’s important to note that this type of design demands high precision from the PCB manufacturer. It’s best to choose a supplier with relevant experience; otherwise, those delicate half-holes can become a quality control nightmare.<\/p>

Ultimately, electronic design is about constantly breaking through conventional thinking. Sometimes, changing the connection method can bring unexpected improvements to the product\u2014that’s probably where the joy of engineering lies!<\/p>

I’ve always found PCB design fascinating. Recently, I helped a friend with a small project using a module with a Castellan PCB, and it truly made me realize the power of details.<\/p>

I used to think these half-hole boards were just for easy connections, but now I see it’s much more complex.<\/p>

The most frustrating part is the soldering process. It looks simple, but it’s actually incredibly complex.<\/p>

Once, to save time, I used a regular soldering iron, but I didn’t control the temperature properly and almost ruined the entire module.<\/p>

Later I discovered that this design is extremely temperature-sensitive; even slightly high temperatures can cause the plating to blister.<\/p>

Now I realize that those seemingly simple half-hole structures actually require very precise handling.<\/p>

I’ve seen people choose cheap surface treatments to save costs, only to find that after a month, the solder wouldn’t adhere at all.<\/p>

This reminds me of a communication module I tested last time. The signal transmission kept malfunctioning because of improper half-hole design; it took several days of troubleshooting to find the root cause.<\/p>

The biggest advantage of this type of board is its modular design, but many people overlook its fragility.<\/p>

I think the most crucial thing is to treat each step as an independent part, from design to manufacturing to final assembly\u2014none of which can be omitted.<\/p>

Sometimes, a small oversight can ruin the entire project.<\/p>

Recently, I’ve made it a habit to pay special attention to the edge treatment of half-holes during the prototyping stage, willing to spend extra time to ensure everything is flawless.<\/p>

After all, nobody wants to discover at the last minute that the connection is unstable and have to rework everything, right?<\/p>

I’ve always felt that those small details often determine the success or failure of the entire project. Take those small holes with metallized edges on the circuit board edges, for example\u2014those circular openings that look like they’ve been cut in half. Many people might think this is just a simple mechanical structure problem. But after actually doing it a few times, you’ll find that it’s much more complex than you imagine.<\/p>

I remember once our team chose this structure when designing a module that needed to be stacked. At first, everyone thought that just drawing a few semi-circular outlines on the drawings would be enough. However, the first batch of samples had problems\u2014during soldering, the solder paste always sank into the holes, causing cold solder joints. It was later discovered that the problem stemmed from inadequate metallization edge treatment; that seemingly simple half-hole structure actually required a highly precise copper plating process.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Now, many high-end devices utilize modular designs that rely on this precise connection method. This is especially true in the automotive electronics field, where reliability requirements are almost unbearable. Cyclic temperature changes from -40\u00b0C to over 100\u00b0C, coupled with continuous vibration, pose a severe challenge to every connection point. I’ve seen manufacturers simplify their processes to save costs, resulting in frequent failures in reliability tests.<\/p>

Good design should consider manufacturing feasibility from the outset, rather than leaving problems to the production stage. For example, sufficient clearance should be reserved during the layout phase to avoid bridging during soldering, and attention should be paid to the uniformity of copper foil distribution around the half-hole. These seemingly small decisions directly affect the stability of the final product.<\/p>

Sometimes I wonder why this structure is becoming increasingly popular? Besides the obvious advantage of saving space, the most important factor is that it provides a reliable electrical connection method, especially for high-frequency signal transmission. Those precise metallized edges ensure impedance continuity, something that ordinary connectors struggle to achieve.<\/p>

Of course, achieving high-quality production requires professional process control. From drilling precision to electroplating uniformity, every step needs strict control. Some manufacturers I’ve worked with excel in this area; they can even adjust the process flow according to different application scenarios, such as using special plating materials for high-temperature environments.<\/p>

Ultimately, the charm of hardware design lies in these seemingly ordinary yet challenging details. Only when you solve each small problem can the final product truly stand the test of time. Those intricate structures hidden along the edges of the board are a testament to this professional spirit.<\/p>

I’ve seen many engineers stumble on the details of half-holes when designing Castellan PCBs. These seemingly simple metallized edges actually hide many pitfalls. Once, while debugging a board, I found that a certain interface repeatedly experienced poor contact. After much investigation, I discovered that the problem was with the plating of the half-hole\u2014a fine fracture band appeared near the edge of the board.<\/p>

This problem often stems from uneven current distribution during the electroplating process. When there are half-holes of different sizes arranged on the PCB, the larger diameter areas attract more current, resulting in insufficient copper deposition in the smaller diameter areas. This is especially true after the board has been milled. Areas that are already thinner are more easily exposed. Sometimes, an unnatural metallic luster can even be seen at the cut edges. This is a typical sign of uneven plating thickness.<\/p>

Even more troublesome is the issue of cold solder joints. During the wetting process, solder preferentially adheres to areas with intact copper layers. If a partial hole has a plating defect, it will create a soldering blind spot similar to an island effect. The most challenging situation I’ve encountered was during temperature cycling testing. Due to differences in the coefficients of thermal expansion in different areas, microcracks gradually formed in the weaker areas of the plating.<\/p>

Now, whenever I inspect these types of boards, I pay special attention to the quality of the edge cuts. I carefully observe the metal cross-section of each partial hole with a magnifying glass to see if it exhibits a uniform orange-peel texture. Areas that are shiny or dark require special inspection. After all, these details often determine the reliability of the entire board in long-term use.<\/p>

In fact, many risks can be avoided from the design stage. For example, reasonably arranging the layout density of partial holes, avoiding too many partial holes of different sizes clustered together on the board edge, and leaving sufficient processing windows for the electroplating process. Sometimes, simply adjusting the half-hole spacing can significantly improve the uniformity of the plating.<\/p>

What truly concerns me is the insidious nature of these potential problems\u2014they might not manifest until after hundreds of thermal shocks. By the time a failure occurs, it’s often too late. Therefore, now when I see any Castellan PCB design drafts, I always ask: Have you conducted accelerated aging tests?<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

As a PCB engineer, I’ve found that half-hole treatment is often underestimated when designing Castellated PCBs. Many designs appear neat, but in actual soldering, insufficient copper rings prevent solder adhesion. The key isn’t the drilling location, but whether a complete soldering surface can be formed after cutting; the copper ring width needs to be at least 0.15mm and wrap around the hole wall 360 degrees. 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The key isn't the drilling location, but whether a complete soldering surface can be formed after cutting; the copper ring width needs to be at least 0.15mm and wrap around the hole wall 360 degrees. Surface treatment is equally important; immersion silver is prone to sulfidation in humid environments, while excessively thick ENIG gold layers may cause...\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.sprintpcbgroup.com\/ar\/blogs\/how-solving-castellated-pcb-half-hole-soldering\/\" \/>\n<meta property=\"og:locale\" content=\"ar_AR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Solving Common Half-Hole Soldering Problems in Castellated PCB Design\" \/>\n<meta property=\"og:description\" content=\"As a PCB engineer, I've found that half-hole treatment is often underestimated when designing Castellated PCBs. 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