Mixed Laminate Multilayer PCB

Hybrid PCB Manufacturers / Mixed Laminate Multilayer PCB Supplier

SprintPCB manufactures Mixed Laminate Multilayer PCB combining FR4, high-frequency materials, high-Tg substrates, and copper-heavy layers to meet advanced performance requirements.

Hybrid Stack-Up Expertise

Our experience with hybrid laminate pcb stack-ups ensures stable bonding, low signal loss, and optimal mechanical performance.

Applications

RF modules
High-speed digital systems
Industrial automation
Power electronics
Aerospace
Telecom & 5G Infrastructure
Such as Mixed Materials Multilayer PCB for RF front-end modules; Satellite Communication PCB and Radar PCB for aerospace modules; High-speed Server PCB for data centers, cloud computing equipment, and high-bandwidth network servers.

Mixed Laminate Multilayer PCB Capabilities

Technology type	Process capability
Materials	FR4 + Rogers
Impedance control	Controllable
Structures	Thermal-enhanced structures
Special processes	Blind/buried vias
Other	Customized stack-ups based on the application

PCB Roadmap

Feature	Prototype production	Mass production	R&D
Layers count	1-40	1-20	60
Minimum board thickness (with solder mask)	0.3mm	0.6mm	0.20mm
Maximum board thickness	6mm	4mm	10mm
Maximum board size	546mm x 622mm	457mm x 610mm	1250mm x 570mm
Minimum line/space innerlayer (depends on copper weight)	2.5mil/2.5mil	3mil/3mil	2mil/2mil
Surface finish types	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG
Mechanical hole size (Finish hole size)	0.15 mm	0.2 mm	0.1 mm
Maximum aspect ratio PTH	20:01	12:01	20
Finished tolerance PTH	+/-0.075 mm	+/-0.05 mm	+/-0.025 mm
Finished tolerance NPTH	+/-0.05 mm	+/-0.025 mm	+/-0.015 mm
Epoxy filled through holes (Y/N)	Y	Y	Y
Capped via (Heat dissipation) (Y/N)	Y	Y	Y

PCB Delivery Time

PCB Quantity (㎡)	2-10 Layer PCB Delivery Time	12-20 Layer PCB Delivery Time
＜1㎡	1 – 8 days	4 – 13 days
1 ㎡ – 5 ㎡	2 – 10 days	5 – 15 days
6 ㎡ – 20 ㎡	4 – 15 days	7 – 19 days
≥20㎡	7 – 18 days	10 – 23 days

Other PCB products

Providing you with one-stop PCB manufacturing and PCB assembly services

Reliable and stable products

Professional engineering support

Fast and on-time delivery

Full-process customer service

Our PCB manufacturing equipment

SprintPCB Group possesses the industry’s most advanced PCB manufacturing equipment, ensuring your PCB products are delivered to you with the highest quality on time and within the agreed delivery period.