HDI PCB

Custom HDI PCB Manufacturer for High-Density Electronics

SprintPCB specializes in HDI PCB manufacturing using microvia technology, enabling compact designs with improved electrical performance.

Our High-Density Interconnect PCB solutions support networking devices and IoT modules, etc.

Advanced HDI Technology

We offer a full range of services from HDI PCB prototyping to mass production. and microvia HDI Board, laser drilling, stacked and staggered vias, via-in-pad, and fine-line etching.
Our process ensures tight registration, excellent layer alignment, and robust interconnect reliability.

Applications

Networking equipment
Compact industrial devices
Security & Surveillance Electronics
Such as HDI PCB and Impedance Control PCB for high-definition imaging and signal integrity; HDI PCB for compact communication modules; HDI PCB for compact communication modules; Controller PCB for access control and sensor systems; Small cell PCB; Camera module PCB; Display control PCB; IoT sensor PCB; Medical imaging PCB; Biometric sensor PCB; Satellite communication PCB; Automotive sensor PCB, etc.

HDI PCB Capabilities

Technology type	Process capability
HDI builds	1+N+1 to 4+N+4,any layer in R&D HDI structures
Trace / Space	75 µm
Drilling type	Laser microvias
Special processes	Via-in-pad plated over
Other	High-speed material options

PCB Roadmap

Feature	Prototype production	Mass production	R&D
Layers count	1-40	1-20	60
Minimum board thickness (with solder mask)	0.3mm	0.6mm	0.20mm
Maximum board thickness	6mm	4mm	10mm
Maximum board size	546mm x 622mm	457mm x 610mm	1250mm x 570mm
Minimum line/space innerlayer (depends on copper weight)	2.5mil/2.5mil	3mil/3mil	2mil/2mil
Surface finish types	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG	OSP, HASL, ENIG, Immersion Silver, Immersion Tin, Hard gold (Connector board), hard gold (Selective board), soft gold, ENEPIG
Mechanical hole size (Finish hole size)	0.15 mm	0.2 mm	0.1 mm
Maximum aspect ratio PTH	20:01	12:01	20
Finished tolerance PTH	+/-0.075 mm	+/-0.05 mm	+/-0.025 mm
Finished tolerance NPTH	+/-0.05 mm	+/-0.025 mm	+/-0.015 mm
Epoxy filled through holes (Y/N)	Y	Y	Y
Capped via (Heat dissipation) (Y/N)	Y	Y	Y

PCB Delivery Time

PCB Quantity (㎡)	2-10 Layer PCB Delivery Time	12-20 Layer PCB Delivery Time
＜1㎡	1 – 8 days	4 – 13 days
1 ㎡ – 5 ㎡	2 – 10 days	5 – 15 days
6 ㎡ – 20 ㎡	4 – 15 days	7 – 19 days
≥20㎡	7 – 18 days	10 – 23 days

Other PCB products

Providing you with one-stop PCB manufacturing and PCB assembly services

Reliable and stable products

Professional engineering support

Fast and on-time delivery

Full-process customer service

Our PCB manufacturing equipment

SprintPCB Group possesses the industry’s most advanced PCB manufacturing equipment, ensuring your PCB products are delivered to you with the highest quality on time and within the agreed delivery period.